The GE 259B2460BTG2 Backplane Assembly Board is a critical component for industrial automation systems, designed for seamless integration into complex control networks to enhance system reliability and efficiency.
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The GE 259B2460BTG2 Backplane Assembly Board is a critical component for industrial automation systems, designed for seamless integration into complex control networks to enhance system reliability and efficiency.
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Brand:GE
Model:259B2460BTG2
Type:Backplane Assembly Board
Series:Mark VII
Function:Data transmission and processing
Dimensions:L x W x H: 200mm x 100mm x 50mm
Weight:0.7kg
Connection Ports:8 high-speed serial ports
Operating Temperature:-40°C to +85°C
Storage Temperature:-40°C to +85°C
Power Supply:12V DC
Maximum Current Draw:1A
This backplane assembly board from GE is specifically engineered for compatibility with its range of industrial control modules, ensuring robust performance and longevity in harsh environments.
Crafted from high-grade aluminum alloy, it provides exceptional thermal conductivity and durability, making it ideal for high-temperature industrial applications.
Featuring a compact yet spacious design, the board supports multiple modules, facilitating easy expansion and customization of your control network.
With an operating temperature range of -40°F to 140°F (-40°C to 60°C), this board ensures reliable operation across a wide spectrum of industrial settings, from freezing cold warehouses to hot manufacturing floors.
Backed by GE’s commitment to quality and innovation, this backplane assembly board is designed to minimize downtime and maximize efficiency in your industrial automation processes.
